Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem

Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
Volume 11 No. 1, July 2015, Pages 1-18

R. Rosli1, K. A. Mohd Annuar2, F. S. Ismail1,*
1Centre of Artificial Intelligence and Robotics, Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 UTM Johor Bahru, Johor, Malaysia
2Faculty of Engineering Technology, Universiti Teknikal Malaysia Melaka, 76100 Durian Tunggal, Hang Tuah Jaya, Melaka, Malaysia
*Corresponding author: fatimahs@utm.my

KEYWORDS

Heat sink, Thermal analysis, Heat transfer, Optimization

ABSTRACT

Due to the advanced development in semiconductor technology, the size of electronic component and devices become smaller while the performance becomes significantly greater. The increased of power density in the system causes the system components to either operate at higher temperature which led to thermal problem. This thermal problem will reduce the performance and efficiency of the electronics package. The most popular device used for electronic cooling is heat sink. In order to improve the heat transfer process, various type of heat sink with different shapes, materials and dimensions have been designed. This study aims to provide the optimal heat transfer of heat sink to minimize electronic package thermal distribution. This study only focuses on circular and square types of pin fin heat sink with various arrangements. In this study, COMSOL Multiphysics software will be used to simulate various pin fins arrangement design of the heat sink model. The results have proposed a new arrangement of the pin fin that able to give better thermal performances which are 4.1% and 0.5% for circular type and 0.2% and 0.4% for square type compared to inline and staggered arrangement.

CITE THIS ARTICLE

MLA
Rosli, R., et al. “Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem.” Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 11.1 (2015): 1-18.

APA
Rosli, R., Mohd Annuar, K. A., & Ismail, F. S. (2015). Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 11(1), 1-18.

Chicago
Rosli, R., K. A. Mohd Annuar, and F. S. Ismail. “Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem.” Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 11, no. 1 (2015): 1-18.

Harvard
Rosli, R., Mohd Annuar, K.A. and Ismail, F.S., 2015. Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 11(1), pp.1-18.

Vancouver
Rosli, R, Mohd Annuar, KA, Ismail, FS. Optimal Pin Fin Heat sink Arrangement for Solving Thermal Distribution Problem. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences. 2015;11(1):1-18.

REFERENCES

[1] L.C. Jenkins, A. Bennett, 21st century challenge: thermal management design requirements. Digital Avionics Systems Conference, DASC04, 2004, pp. 1-7.
[2] P. Ravibabu, K. Rajshekar, K.R. Gupta, Heat pipes – integrated circuit coolers. Nanoelectronics Conference (INEC), 3rd International 260-264 (2010).
[3] M.C. Zaghdoudi, A. Teytu. Use of heat pipes for avionics cooling. Electronics Packaging Technology Conference 425-430 (2000).
[4] F. Yongling, Z. Meng, Q. Haitao, A. Gaocheng, Application of heat pipe technology in the design of hydraulic motor pump. Electronic and Mechanical Engineering and Information Technology (EMEIT) 1033-1036 (2011).
[5] C. Anbin, X. Fengyu, L. Xiaokun, H. Yubao, W. Zonglin, Z. Yingshun, Sub-Cooled Liquid Nitrogen Test System for Cooling HTS Synchronous Motor. Applied Superconductivity, IEEE Transactions 22 (2012) 4701304-4701304.
[6] D.L.V. Andrea, G. Stefano, G. Franco, Optimum design of vertical rectangular fin arrays. International Journal of Thermal Sciences (1999) 525-529.
[7] Y. Kondo, H. Matsushima, T. Komatsu, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages. Journal Electronic Packaging 122 (2000) 240-246
[8] D.K. Kim, J.K. Bae, S.J. Kim, Comparison of Thermal Performances of Plate-Fin and Pin-Fin Heat Sink Subject to an Impinging Flow. International Journal of Heat and Mass Transfer (2009) 3510-3517.
[9] K.A.M. Annuar, M.F.M. Ab Halim, F.S. Ismail, M. Zahari, S.H. Johari, M.H. Harun. Thermal Analysis of Staggered Pin Fin Heat Sink for Central Processing Unit. Australian Journal of Basic & Applied Sciences 9 (2015) 68-73.
[10] N. Hamadne, W.A. Khan, S. Sathasivam, H.C. Ong, Design Optimization of Pin Fin Geometry Using Particle Swarm Optimization Algorithm. PLoS One 8 (2013) pe66080H.
[11] C.J. Shih, G.C. Liu, Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy. IEEE Transactions on components and packaging technologies 27 (2004) 551-559.
[12] C.T. Chen, C.K. Wu, C. Hwang, Optimal Design and Control of CPU Heat Sink Processes. IEEE Transaction on Component and Packaging Technologies 31 (2008) 184-195.
[13] X. Zhang, D. Liu, Optimal geometric arrangement of vertical rectangular fin arrays innatural convection. Energy conversion and management 51 (2010) 2449-2456.
[14] M.Z.M. Hanafi, F.S. Ismail, Multi-objective optimal thermal heat sink design using evolutionary method. Jurnal Teknologi 72 (2015) 1-6.
[15] R. Mohan, P. Govindarajan, Thermal analysis of CPU with variable heat sink base plate thickness using CFD International Journal of the Computer 18 (2010) 27-36.
[16] V.U. Patel, A.J. Modi, Optimization of heat sink analysis for electronic cooling. Proceeding of a National Conference on Advances in Mechanical Engineering (NCAME-2012) 64-69 (2012).
[17] D. Geb, I. Catton, Nonlocal Modeling and Swarm-Based Design of Heat Sinks. Journal of Heat Transfer 136 (2014) 011401.
[18] M.Z.M. Hanafi, F.S. Ismail, Heat Sink Model and Design Analysis Based on Particle Swarm Optimization. IEEE Innovative Smart Grid Technologies –Asia (ISGT ASIA) (2014) 726-731.
[19] K.A.M. Annuar, F.S. Ismail, Optimal Pin Fin Arrangement of Heat Sink Design and Thermal Analysis for Central Processing Unit. 5th International Conference on Intelligence and Advance Systems (ICIAS14) (2014) 1-6.