Numerical Heat Transfer Analysis in Microchannel Heat Sink with Different Aspect Ratio

Authors

  • Qamar Fairuz Zahmani Faculty of Engineering Technology, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Muhammad Nur Othman Faculty of Engineering Technology, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Mohd Faruq Abdul Latif Faculty of Engineering Technology, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Siti Nor’ain Mokhtar Faculty of Engineering Technology, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Nik Nazri Nik Ghazali Faculty of Engineering, Universiti of Malaya, Jalan Universiti, 50603 Kuala Lumpur, Wilayah Persekutuan Kuala Lumpur, Malaysia
  • Ahmad Yusof Ismail Department of Mechanical Engineering, Institut Teknologi Adhi Tama Surabaya, Jalan Arief Rachman Hakim, Klampis Ngasem, Sukolilo, Kota SBY, Jawa Timur 60117, Indonesia

Keywords:

microchannel heat sink, heat transfer, thermal fluid

Abstract

The cooling of electronic devices is essential to guarantee their functional performance and operational lifetime. Due to continued miniaturization and integration of transistors in packaged chips, the heat dissipation rate has surpassed the limits of classical air-cooled heat sinks. This has triggered a lot of research towards alternatives for high heat flux cooling. Liquid cooling with micro heat sinks is one of these candidate solutions. Cold liquid flows through microscopic channels to extract heat from the chip. In this paper, the studied is focused on the effect of aspect ratio in the Microchannel Heat Sink (MCHS) using numerical analysis, and the result obtained is discussed in this paper. The overall result of the present work shows there is a close relationship between both the numerical and analytical data.

Published

2021-08-03
فروشگاه اینترنتی