Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach
Keywords:SAC387, stencil printing, lead-free solder
In this paper, Computational Fluid Dynamic (CFD) simulation approach is used to study the flowability of lead-free solder SAC387 in stencil printing process. The Volume of Fluid (VOF) method is used to simulate the multiphase flow between air and SAC387. The simulations are carried out at five different aperture area sizes. This paper focuses on the aperture filling of SAC387 where the result of the volume of SAC filling will be discussed. Results show that the volume error of the biggest aperture is 13.9% while the smallest aperture is 17.9%.