Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach

Authors

  • Mohd Syakirin Rusdi School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
  • Mohd Zulkifly Abdullah School of Aerospace Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
  • Mohd Sharizal Abdul Aziz School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
  • Muhammad Khalil Abdullah@Harun School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
  • Srivalli Chellvarajoo School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia
  • Azmi Husin Faculty of Mechanical Engineering, Universiti Teknologi MARA Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia
  • Parimalam Rethinasamy Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia
  • Sivakumar Veerasamy Celestica Malaysia Sdn. Bhd., Plot 15, Jalan Hi-Tech 2/3 Phase I, Kulim Hi-Tech Park, 09000 Kulim, Malaysia

Keywords:

SAC387, stencil printing, lead-free solder

Abstract

In this paper, Computational Fluid Dynamic (CFD) simulation approach is used to study the flowability of lead-free solder SAC387 in stencil printing process. The Volume of Fluid (VOF) method is used to simulate the multiphase flow between air and SAC387. The simulations are carried out at five different aperture area sizes. This paper focuses on the aperture filling of SAC387 where the result of the volume of SAC filling will be discussed. Results show that the volume error of the biggest aperture is 13.9% while the smallest aperture is 17.9%.

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Published

2020-12-01

How to Cite

Rusdi, M. S. ., Abdullah, M. Z. ., Abdul Aziz, . M. S. ., Abdullah@Harun, M. K. ., Chellvarajoo, S. ., Husin, A. ., Rethinasamy, P. ., & Veerasamy, S. . (2020). Multiphase Flow in Solder Paste Stencil Printing Process using CFD approach . Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 46(1), 147–152. Retrieved from https://www.akademiabaru.com/submit/index.php/arfmts/article/view/2212

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