Extrinsic Activation Energy for Enhanced Solid-State Metallic Diffusion for Electrical Conductive Ink

Authors

  • Intan Fatihah Ahmad Faculty of Mechanical Engineering Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100 Durian Tunggal, Melaka, Malaysia
  • Ghazali Omar Centre for Advanced Research on Energy, Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100, Durian Tunggal, Melaka, Malaysia
  • Mohd Azli Salim Centre for Advanced Research on Energy, Faculty of Mechanical Engineering, Universiti Teknikal Malaysia Melaka, Hang Tuah Jaya, 76100, Durian Tunggal, Melaka, Malaysia

Keywords:

electrons, solid-state, diffusion mechanism, stretchable conductive ink

Abstract

In the new area of Advanced Manufacturing Technology, Stretchable Conductive Ink (SCI) has become a future electronic circuit with some unique properties. The Printed Circuit Board (PCB) and other electronic rigid sheet substrate will be shifting into flexible thin layers. SCI will act as interconnect for electronic components. However, the information about diffusion mechanism in SCI is still limited at this time. Therefore, the purpose of this paper is to disseminate information on the role of diffusion mechanism enhance the conductivity in SCI. In addition, this paper introduces the relationship between diffusion mechanism and electron mobilization. Based on this review, the usage of extrinsic energy holds a great potential to enhance the diffusion mechanism in SCI.

Downloads

Published

2020-12-01

How to Cite

Ahmad, I. F. ., Omar, G. ., & Salim, M. A. . (2020). Extrinsic Activation Energy for Enhanced Solid-State Metallic Diffusion for Electrical Conductive Ink. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 50(1), 32–39. Retrieved from https://www.akademiabaru.com/submit/index.php/arfmts/article/view/2309

Issue

Section

Articles

Most read articles by the same author(s)