Heat Transfer Enhancement Using Nanofluids For Cooling A Central Processing Unit (CPU) System

Authors

  • Husam Abdulrasool Hasan Department of Air Conditioning and Refrigeration Engineering, Al Esra'a University College, Baghdad, Iraq
  • Zainab Alquziweeni College of science - university of Baghdad, Baghdad, Iraq
  • Kamaruzzaman Sopian Solar Energy Research Institute, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia

Keywords:

Cooling Central Processing Unit (CPU), heat transfer, numerical simulation, Nusselt number

Abstract

The effect of using different types of nanofluids as a coolant fluid in a CPU cooling on the heat transfer enhancement and fluid flow were studied numerically. The continuity, momentum and energy equations were solved by means of a finite volume method (FVM). This study covers the Reynolds number range of 5000 to 15000. Four different types of nanoparticles, Al2O3, CuO, SiO2, and ZnO with different nanoparticle diameters in the range of 20nm to 50nm have been used. The volume fraction of the different types of nanofluid are considered as 1%,2%,3% and 4% have been also employed in water for the cooling process. The numerical results indicated that the Nusselt number increased with the increase of the Reynolds number in case of using water as coolant fluid. The skin friction coefficient increased with the increase of the Reynolds number in case of using water as coolant fluid. The SiO2 nanofluid has the highest Nusselt number value, followed by Al2O3, ZnO and CuO. Finally pure water has the lowest Nusselt number. It has been observed that the SiO2 nanofluid has the highest skin friction coefficient, followed by Al2O3, ZnO and CuO. Pure water has the lowest skin friction coefficient. The Nusselt number is improved with the increase of nanoparticle concentration. The Nusselt number increased with the decrease of nanoparticles diameter. The local Nusselt number considerably increased with increasing Reynolds number and local skin friction coefficient considerably increased with increasing Reynolds number.

Downloads

Published

2020-12-01

How to Cite

Hasan, H. A. ., Alquziweeni, Z. ., & Sopian, . K. . (2020). Heat Transfer Enhancement Using Nanofluids For Cooling A Central Processing Unit (CPU) System. Journal of Advanced Research in Fluid Mechanics and Thermal Sciences, 51(2), 145–157. Retrieved from https://www.akademiabaru.com/submit/index.php/arfmts/article/view/2342

Issue

Section

Articles