SAC105 Stencil Printing Process using Cross Viscosity Model
Keywords:
SAC105, rheology, stencil printing, SMT, lead-free solder pasteAbstract
The current study shows the used of rheological measurement to get lead-free solder paste SAC105 type 3 viscosity data to be used in numerical measurement. A parallel-plate viscometer is used for the rheological measurement. From the measurement data, numerical simulation investigation is accomplished to study the effect of stencil thickness on SAC105. Cross model is used as the viscosity model for the SAC105. The numerical simulations using ANSYS Fluent with Finite Volume Method (FVM) are carried out at five different stencil thickness. The results show that the volume difference between aperture volume and SAC105 volume are low at 0.0762mm and 0.1016mm (14.6% and 13.9 respectively) and the maximum volume difference is at 0.1778mm (45.4%).