Sahrudin, I. N., M. S. . Abdul Aziz, M. Z. . Abdullah, and M. A. A. . Mohd Salleh. “Study on the Addition of Nanoparticles in the Lead-Free Solder During Reflow Soldering via Numerical Simulation - A Review”. CFD Letters, vol. 12, no. 5, Jan. 2021, pp. 111-9, https://www.akademiabaru.com/submit/index.php/cfdl/article/view/3250.