Hafiz Ishak MH, Ismail F, Abdullah MZ, Abdul Aziz MS, Yusoff H, Tena’ain M, Saedi N, Hamid A. Fluid–Structure Interaction Study of IC Stacking Chips Arrangement During Encapsulation Process. CFD Lett. [Internet]. 2021Jan.16 [cited 2024Apr.19];11(4):1-15. Available from: https://www.akademiabaru.com/submit/index.php/cfdl/article/view/3151